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Partners
Our innovations in high-performance and low-power interface technologies are supported by the industry's top-tier network of partners. Leading silicon, systems, ASIC/Foundries, IP providers, test and measurement, EDA and design services companies provide a complete solution for products based on Rambus technology. These partnerships enable Rambus' customers to incorporate interoperable and silicon-proven solutions maximizing productivity, quality and predictability.
These partnerships are important because achieving first-pass silicon success for high-speed and low-power mixed signal interfaces presents a host of unprecedented challenges. These issues can tax the resources and expertise of even the most capable design and manufacturing organizations. In short, no one company can do it alone. Our customers' success in the nanometer era hinges on collaboration among leading companies in the silicon design chain.
Memory Partners
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Elpida Memory, Inc.
Elpida Memory, Inc., (Tokyo Stock Exchange: Code 6665), is a leading global manufacturer of Dynamic Random Access Memory (DRAM) silicon chips. Our design, manufacturing, and sales operations are backed by our world-class technology expertise. Our manufacturing facilities, Hiroshima Elpida Memory, Inc. (wafer processing) and Akita Elpida Memory, Inc. (packaging and testing), utilize the most advanced manufacturing technologies available in the industry. Elpida's portfolio of advanced products features such characteristics as high-density, high-speed, low power and small packing profiles. The company provides applications across a wide range of areas, including high-end servers, mobile phones and digital consumer electronics. For more information about Elpida, please visit http://www.elpida.com.
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Samsung Electronics
Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2005 parent company sales of US$56.7 billion and net income of US$7.5 billion. Employing approximately 128,000 people in over 90 offices in 51 countries, the company consists of five main business units: Digital Appliance Business, Digital Media Business, LCD Business, Semiconductor Business and Telecommunication Network Business. Recognized as one of the fastest growing global brands, Samsung Electronics is a leading producer of digital TVs, memory chips, mobile phones, and TFT-LCDs. For more information, please visit www.samsung.com.
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Ecosystem Partners
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Cadence
Cadence enables global electronic-design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence® software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. Cadence reported 2006 revenues of approximately $1.5 billion, and has approximately 5,300 employees. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
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ChipX
ChipX, Inc. is a Mixed-Signal ASIC company with the broadest offering of value-added ASIC solutions, including Standard Cell, Structured ASIC, Embedded Array and Hybrid ASIC technology. ChipX has unique expertise in PCI Express, USB 2.0, DDR/DDR2 and data conversion Mixed-Signal cores; all are silicon proven and certified and they can be integrated in customers' ASICs with a record first-time to market success. ChipX products are widely used in consumer equipment, computing peripherals, communication systems, instrumentation and industrial control, medical equipment and military/aerospace systems. Headquartered in Santa Clara, CA, ChipX is a privately held corporation, with a Research and Development subsidiary in Israel. Investors include Elron Electronic Industries, Ltd. (NASDQ: ELRN), VantagePoint Venture Partners, Wasserstein Venture Capital, UMC and Needham Capital Partners.
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Cypress
Cypress delivers high-performance, mixed-signal, programmable solutions that provide customers with rapid time-to-market and exceptional system value." Cypress offerings include the PSoC® Programmable System-on-Chip™, USB controllers, general-purpose programmable clocks and memories. Cypress also offers wired and wireless connectivity solutions ranging from its WirelessUSB™ radio system-on-chip, to West Bridge™ and EZ-USB® FX2LP controllers that enhance connectivity and performance in multimedia handsets. Cypress serves numerous markets including consumer, computation, data communications, automotive, industrial, and solar power. Cypress trades on the NYSE under the ticker symbol CY. Visit Cypress online at www.cypress.com.
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eSilicon and Rambus
eSilicon, a pioneering semiconductor Value Chain Producer (VCP), provides a comprehensive suite of design, productization and manufacturing services, enabling a flexible, low-cost, lower-risk path to volume production of integrated circuits (ICs). The company delivers chips to system original equipment manufacturers (OEMs) and fabless semiconductor companies who serve a wide variety of markets including the consumer, computer, communications and industrial segments.
eSilicon creates a unique, optimized semiconductor Value Chain for each customer and each design - from design services and tools, to IP and materials suppliers, to test and packaging providers. By integrating this Value Chain with its internal expertise and proven eSilicon Enterprise™ infrastructure, the company has produced more than 30 million leading-edge chips for a wide range of applications including consumer, computer, communications and industrial solutions.
As a semiconductor Value Chain Producer, eSilicon has a long track record of succcessful engagements with our customers to implement chips involving both complex and simple IP blocks. The value that eSilicon brings to its customers is successful integration of complex IP (e.g. SerDes) with a multitude of other IP on the same chip and quickly productizing the chips into volume production, thus enabling our customers' silicon success.
eSilicon has utilized SerDes IP from Rambus, one of its Value Chain partners to successfully design, manufacture and productize chips for many different customers. These customers represent the communications, networking and storage market segments and the engagements involved both netlist handoff and gdsii handoff engagements.
To learn more about eSilicon and what it can offer, please visit http://www.esilicon.com/about_us/about_us.php or send an e-mail to info@esilicon.com.
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GDA Technologies and Rambus
GDA Technologies is a leading Electronic Design Services (EDS) and Silicon Intellectual Property (SIP) solution provider for the Embedded, Networking, and Consumer Electronics Market. GDA is part of the L&T Infotech Product Engineering Services (PES) offerings, which aims to provide end-to-end product design capability to its customers. GDA and Rambus work closely together to meet customers' accelerated time-to-market needs by utilizing Rambus' leading IP solutions and GDA's comprehensive design services. GDA is a reseller and integrator of Rambus digital core intellectual property (IP) products, which include a complete line of controller cores for PCI Express, Ethernet, SPI4.2 and RapidIO implementations. All core architectures are highly configurable and tailored to optimize link utilization and latency while minimizing power consumption and silicon footprint. The PCI Express cores support standard versions 1.1 and 2.0 and include end point, root complex, hybrid (root complex and end point), switch port, and entire switches. Bridge interfaces to standard on-chip buses such as AHB and AXI are also available.
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PGC and Rambus
Progate Group Corporation (PGC), established in 1991, is a world-class IC design turnkey service company. It is part of TSMC Design Center Alliance (DCA) program for over ten years. PGC's rich design experiences can provide customers the benefits of first-silicon-right and fast-time-to-market.
The gate array ASIC and structured ASIC that PGC offers are good solutions for NRE cost-sensitive customers. These two solutions can provide not only low-NRE solutions but also fast turn-around time. They are suitable for most mid-to-small volume customers. In addition to the gate array and structured ASIC, PGC also provides excellent IP integration for SOC projects. PGC can provide the customers experienced IP integration and netlist-to-GDS II design turnkey service.
PGC and Rambus Inc. have collaborated to develop fully integrated and independently verified PCIe solution. By collaborating with Rambus, PGC provides the client a high-end PCI-Express switch chip, which integrates high performance PCI-Express switch and PCI bridge functionality. It has been qualified for compliance test of PCI-SIG.
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Tektronix
Tektronix is a leading supplier of test, measurement, and monitoring products, solutions and services for the communications, computer, and semiconductor industries - as well as military/aerospace, consumer electronics, education and a broad range of other industries worldwide. With 60 years of experience, Tektronix enables its customers to design, build, deploy, and manage next-generation global communications networks, computing and advanced technologies. Headquartered in Beaverton, Oregon, Tektronix has operations in 19 countries worldwide. Tektronix' Web address is www.tektronix.com.
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